Deal
GlobalFoundries has won a USD 3.1 billion US government contract
GlobalFoundries secures a 10-year contract with the U.S. Department of Defense. They will provide advanced chips for defense and aerospace systems, enhancing technological capabilities and ensuring national security. Read More>>
Partnerships
MediaTek partners with Mouser for Global Embedded Processors and SoCs
MediaTek and Mouser Electronics to offer IoT SoCs and modules, enabling faster development of smart applications. This collaboration aims to enhance MediaTek’s global distribution network and provide design engineers with easier access to advanced semiconductor solutions. Read More>>
MediaTek joins forces with Newland EMEA
The company aims to enhance hardware performance, connectivity, and innovation in the AIDC industry. They seek to empower businesses with innovative scanning and connectivity solutions & emphasize efficiency and security. Read More>>
Centre Setup and Expansion
GlobalFoundries opens new hub facility in Penang
GlobalFoundries has inaugurated a new hub facility in Penang and Malaysia to oversee its global operations. They aim to enhance supply chain resilience and support semiconductor manufacturing innovation in the facility. Read More>>
Merger and Acquisition
Cadence to acquire Intrinsix Corporation from CEVA
Cadence Design Systems is acquiring Intrinsix Corporation to enhance its aerospace and defense industry expertise. The CEVA will focus on its core semiconductor IP and software for wireless communications, sensing, and edge AI technologies. Read More>>
Executive Movements
Intel appoints Gokul Subramaniam as Intel India President
Subramaniam will oversee engineering and design operations, with his 11 years of technical and business leadership experience. Read More>>
CEVA Inc. appoints Iri Trashanski as Chief Strategy Officer
Trashanski to drive global strategy corporate development and marketing. With his 20+ years of semiconductor industry expertise. Trashanski’s leadership spans respected companies to enhance CEVA’s future growth. Read More>>
New Product Development and Product Launch
Snapdragon 8 Gen 3 to arrive with two variants – TSMC 4nm and 3nm process
Qualcomm is set to launch the Snapdragon 8 Gen 3 at the Snapdragon Summit with two variants. Smartphones from various brands are expected to feature this powerful chipset and it will be intriguing to see the performance differences between the variants. Read More>>
Layoff
Intel cuts at least 14 jobs in US
Intel is cutting at least 140 jobs in the US, with 89 employees at its Folsom R&D campus and 51 in California. With an aim to reduce costs amid a challenging economic environment, this move is part of Intel’s ongoing cost reduction and efficiency efforts. Read More>>
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