Samsung Networks and Intel Work to evolve virtual RAN

Partnerships
Synopsys and Intel Partner to expand IP and EDA Pact for Chip Design
They aim to enhance their intellectual property and design, aiming to create IP offerings for Intel’s foundry customers on the Intel 3 and Intel 18A processes, advancing high-performance chip designs. Read More>>
Samsung Networks and Intel Work to evolve virtual RAN
Samsung Networks and Intel are partnering to optimize network infrastructure, enabling Samsung’s VRAN 3.0 software on Intel’s Xeon CPUs with VRAN Boost, enhancing power efficiency and stability in 5G networks. Read More>>

Deal
Sivers Semiconductors Inc receives USD 375,000 award under the DARPA NGMM Program
The company collaborated with PseudolithIC Inc. to develop 3D integration for RF SOI beamformers and III-V front ends, targeting 5G and defense applications. This aligns with the US CHIPS ACT’s semiconductor research initiative. Read More>>

Centre Setup and Expansion
Vishay Intertechnology opens a new state-of-the-art resistors manufacturing facility in Ciudad Juárez, Mexico
The new facility aims to enhance the output of WSLx Power Metal Strip® resistors for various applications, ensuring quicker lead times within eight weeks. The move addresses increased demand from the automotive, industrial, consumer, and aerospace sectors for accurate, current sensing. Read More>>
Texas Instruments to spend USD 1 Bn on PHL plants expansion
The company aims to expand Philippine facilities in Clark and Baguio, in line with US semiconductor production goals, aiming to alleviate global microchip shortages. Read More>>

Executive Movement
Vanguard International USA promotes Ethan Williams
Ethan Williams has been promoted to Vice President of Global Sales and Marketing at Vanguard International USA LLC, transitioning from his role as Sales Manager. He brings experience from Pretty Lady Vineyards and will assume his new role on September 1, 2023. Read More>>

Layoff
Intel implements further US layoffs to trim costs
Intel is reportedly cutting around 140 employees in the US, including 89 from the Folsom R&D campus and 51 in San Jose, California, affecting various positions, including GPU and system software development engineers. Read More>>

Product Launch
Intel has launched the first processors that have vRAN acceleration integrated
Intel has announced the release of its latest innovation, the Xeon Scalable Gen4 processors featuring integrated vRAN acceleration technology. These processors cater to the needs of telecom companies by efficiently running baseband functions through non-proprietary software on any server. Read More>>
Nexperia launches its first integrated 5 V load switch
Nexperia introduces its first 5V Integrated Circuit load switch, NPS4053, featuring safety features for applications like notebooks, desktops, and automotive infotainment. The device offers precise current control, reverse current blocking, and compact design, simplifying circuitry while conserving power in battery-operated devices. Read More>>

New Product Development
Intel claims huge DX9/11 improvements and introduces the PresentMon Beta tool
PresentMon Beta is a monitoring and capture tool that enhances user experience with real-time metrics, configurable overlay, and open-source multi-vendor support. This tool offers insights into system performance and is compatible with major GPU vendors, promising smoother operations. Read More>>

• MediaTek’s cutting-edge chipsets, including the Dimensity 6000 series and Dimensity 9200+, create advanced in-vehicle AI cabin solutions and offer support for 5G broadband services through integrated AI applications.      
• MediaTek is advancing its 5G technology offerings, producing a range of 5G chipsets with advanced features and capabilities and developing solutions for wireless connectivity technologies like Wi-Fi Bluetooth, which enables seamless and reliable device communication.   
• MediaTek’s Dimensity 8200, a high-end 5G chipset designed for smartphones, offers flagship-level experiences, gaming improvements with HyperEngine 6.0, powerful imaging capabilities, an integrated 5G modem with 3CC carrier aggregation, and tri-band Wi-Fi 6E support, delivering impressive performance and connectivity at a competitive price.    
• MediaTek’s Kompanio 520 and Kompanio 528 chipsets, tailor-made for Chromebooks, offer enhanced computing performance, extended battery life, and improved connectivity, providing users with a seamless and efficient experience.

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