|
Partnerships
Qualcomm and Meta collaborate to optimize Llama 2 large language models on-device
They aim to enable generative AI experiences on smartphones, PCs, VR/AR headsets, and vehicles, reducing cloud reliance and costs. Qualcomm plans to implement Llama 2-based AI on Snapdragon devices in 2024. Read More>>
Toshiba and MikroElektronika to accelerate automotive motor control development
They aim to integrate the TB9053 DC-motor driver IC into the DC Motor 26 Click Board, simplifying design and enabling compact ECUs for automotive applications. The TB9053’s features and diagnostic capabilities enhance reliability and performance. Read More>>
Semtech collaborates with UnaBiz
They will enable Sigfox 0G on Semtech’s LoRa Edge™ and LoRa Connect™ platforms. The collaboration enhances IoT solutions by combining LoRaWAN® and Sigfox 0G technologies for global coverage, benefiting industries like supply chain and logistics. Read More>>
Deals
Axcelis announces shipment of Purion H200 SiC Power Series Implanter to Wolfspeed
Axcelis Technologies ships a Purion H200™ SiC ion implant system to Wolfspeed to support the production of power devices for electric vehicle applications. The partnership aims to meet the growing demand for Wolfspeed’s silicon carbide devices in the EV market. Read More>>
Synaptics enters a new wireless deal with Broadcom
Synaptics extends its wireless license agreement with Broadcom, adding Wi-Fi 7, Bluetooth 6.0, and Bluetooth Enterprise TWS IP to its portfolio until 2026. This expands IoT connectivity options for applications like multimedia, automotive, security, and audio. Wi-Fi 7 devices available for sampling in 2024. Read More>>
Centre Setup and Expansion
Analog Devices invests more than USD 1 Bn in Semiconductor Facility Expansion in Oregon
It will increase cleanroom space, doubling production, and creating hundreds of new job opportunities. The facility also hosts the Semiconductor Advanced Manufacturing University for workforce development training. Read More>>
TSMC to invest USD 2.9 Bn in an advanced chip packaging plant in Taiwan
Taiwan Semiconductor Manufacturing Company will invest USD 2.87 billion in an AI chip packaging plant in Tongluo Science Park, Taiwan, to meet the rising demand. The facility will create about 1,500 local jobs. Read More>>
Micron Technology to create 20,000 jobs by setting up Gujarat plant
Micron Technology reaffirms its plan to build a cutting-edge semiconductor assembly and test facility in Gujarat, India, generating 5,000 direct jobs and 15,000 community jobs. The USD 2.75 billion project will begin construction in 2023, with Phase 1 operational in late 2024. Read More>>
Executive Movement
Qualcomm India appoints Savi Soin as President
With 20+ years at Qualcomm, he formerly headed strategy and business development. Soin aims to strengthen partnerships and oversee India’s strategic role in Qualcomm’s plans. Read More>>
Product Launch
Littelfuse First to release AEC-Q200 Rev E Qualified Fuses
Littelfuse releases AEC-Q200 Rev E Qualified Fuses for compact automotive electronics and EV applications. The portfolio includes various fuses for circuit protection in harsh automotive environments, offering reliability and high inrush current withstand capability. Read More>>
Quectel introduces new generation Android SG885G-WF smart modules
Quectel launched the SG885G-WF Android intelligent module powered by Qualcomm’s QCS8550 SoC. It offers Wi-Fi 7, Bluetooth 5.3, 4K/8K video capabilities, 12GB LPDDR5X, and 256GB UFS memory for diverse IoT applications. Read More>>
|
