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Partnerships
Applied Materials and Fraunhofer IPMS launch European Semiconductor- Metrology Technology Hub
The collaboration is to establish Europe’s largest semiconductor metrology and process analysis technology hub in Dresden, Germany. Equipped with Applied’s eBeam metrology equipment, the hub aims to accelerate learning cycles and enhance wafer-level metrology capabilities in the European semiconductor cluster. Read More>>
Mahindra joins hands with NXP Semiconductors
Mahindra & Mahindra and NXP Semiconductors to explore the electric and connected vehicle landscape. The partnership will cover a wide range of vehicles including utility vehicles, light commercial vehicles, farm equipment, and tractors. Mahindra will also get access to NXP’s robust partner ecosystem and technology roadmap. Read More>>
Deal
Infineon signs IGBT EV deal with Semikron
Infineon Technologies has signed a multi-year volume agreement with Semikron Danfoss to supply silicon power chips for electric vehicle power modules. The chips, including IGBTs and diodes, will be manufactured at Infineon’s sites in Germany and Malaysia. Read More>>
Centre Setup and Expansion
Rohm to open power chip plant in Southwestern Japan
The new power chip plant will open in Kunitomi, Japan to meet the growing demand for power chips in the automotive and industrial equipment industries. It plans to start production by the end of 2024 and aims to increase production capacity by 35 times by 2030. Read More>>
Taiwan’s TSMC to inaugurate global R&D center on July 28
TSMC to open a global R&D center in Hsinchu, Taiwan, with about 8,000 staff. It aims to accelerate the development of advanced chip technology, including 3nm and 2nm processes, despite a sales forecast downgrade. Read More>>
Executive Movement
Chinese Chip Giant SMIC names second new Chairman in under two years
SMIC appointed Liu Xunfeng as chairman, replacing Gao Yonggang. Liu was vice chairman of SMIC and was recommended by China’s National Integrated Circuit Industry Investment Fund. Liu has a background in the chemical industry and previously chaired the Shanghai Huayi Holding Group. Read More>>
Mass Hiring
Intel looks to hire manufacturing technicians at the Rio Rancho facility
Intel will host a “MEGA Hiring Event” on July 28 in Rio Rancho, New Mexico, to recruit manufacturing technicians for its semiconductor manufacturing facility. Prospective applicants can pre-screen through the New Mexico Workforce Connection website. Walk-ins are also welcome on the day of the event. Read More>>
Layoff
Cirrus Logic to cut 5% of the global workforce
Cirrus Logic Inc. will cut 85 employees (5% of its workforce) due to overall market conditions and the cancellation of a new product launch. The job cuts will result in charges in the fiscal second quarter. Read More>>
Product Launch
Winbond introduces next-generation 8 Mb Serial Flash targeting low-power IoT devices
Winbond Electronics has introduced the 8Mb W25Q80RV, the first in its new 3V RV series of flash devices, using the latest 58nm technology, reducing die area by 40%. The flash is suitable for space-constrained applications and enables XIP of code at a higher frequency for improved system response and energy efficiency. Read More>>
Toshiba launches tiny common-drain N-channel MOSFET
Toshiba Electronics Europe has launched the 20A SSM14N956L 12V MOSFET for battery protection circuits in Li-ion battery packs used in smartphones, cameras, and power banks. The chip-scale package is compact at 2.74mm x 3.0mm with a height of 0.085mm. Read More>>
Financial and Market Activity
NXP Semiconductors reports second quarter 2023 results
NXP Semiconductors reported Q2 2023 revenue of USD 3.3 billion, down 0.4% YoY, with strong performance in automotive, core-industrial, and communications infrastructure businesses. Non-GAAP diluted net income per share was USD 3.43. The company executed capital return with dividends and share repurchases totaling USD 566 million. Read More>>
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