Intel selects Poland for a USD 4.6 Bn semiconductor facility

Centre Setup and Expansion
Micron plans to inject USD 600 Mn in Chinese chip-packaging plant amid Beijing restrictions
The expansion aims to create 500 new jobs. The investment involves acquiring equipment and expanding assembly lines at the existing facility. Read More>>
Intel selects Poland for a USD 4.6 Bn semiconductor facility
Intel plans to invest USD 4.6 billion in its semiconductor assembly and test facility in Poland, supporting approximately 2,000 employees and creating additional jobs during construction. Pending approval from the European Commission, immediate actions for design and planning will begin. Read More>>
Silicon Labs has opened its Connectivity Lab
The Connectivity Lab in Boston will provide developers with a simulated home environment for testing Matter devices. The lab aims to enhance smart home experiences by exploring various device and network configurations. Interested customers can contact Silicon Labs for more information. Read More>>

Executive Movement
Burkhardt Frick to become the new CEO of SUSS MicroTec
He currently serves as the Vice President of Corporate Marketing and brings experience in long-term product and market strategy. Frick replaces Dr. Bernd Schulte, who will join the company’s Supervisory Board. Read More>>

Layoff
Qualcomm cuts 415 jobs at San Diego headquarters amid lingering smartphone slump
Layoffs will be effective in mid-July. The company also laid off 84 workers in the Bay Area. The reduction is driven by a slowdown in smartphone sales, especially in China, following two previous rounds of layoffs. Read More>>

Product Launch
Toshiba launches 600V super junction N-channel power MOSFET series with ultra-low RDS
Toshiba Electronics Europe has launched the TK055U60Z1, the first product in its new 600V DTMOSVI series of N-channel power MOSFETs. It is designed for applications such as high-efficiency switching power supplies in data centers, power conditioners for photovoltaic generators, and uninterruptible power systems. Read More>>
Qualcomm unveils the Snapdragon 4 Gen 2, its latest chipset for entry-level 5G smartphones
It features the Qualcomm X61 5G modem with download speeds up to 2.5Gbps. The chip supports the 3GPP Release 16 5G standard, offering improved performance and connectivity. Read More>>
BluGlass to display upgraded products at Laser World of Photonics
BluGlass is set to unveil its improved gallium nitride products at the Laser World of Photonics conference in Munich. The launch includes increased performance for single-mode and multi-mode devices, along with a new 397nm single-mode alpha product. The products have applications in ultraviolet lasers for various industries. Read More>>

Improvements in Semiconductor Performance

• Applied Materials Centura Sculpta Patterning System helps chipmakers to elongate the shapes in any chosen direction to reduce the space between features and increase pattern density. The final pattern is created from a single mask, reducing the cost, complexity, and yield risk from double-patterning alignment errors.
• The company will invest in enhancing customer collaboration to accelerate improvements in semiconductor performance, power, and cost and enable the company to increase equipment manufacturing capacity.
• Applied has developed unique eBeam columns that house the eBeam emitter and other critical components, which combine an extreme ultra-high vacuum operating environment and specially developed chamber materials that reduce the presence of contaminants. The company has also developed a cyclical self-cleaning process that continuously removes contaminants from the CFE source.
• Applied has introduced two eBeam systems based on CFE technology, the SEM Vision G10 Defect Review System and the Prime Vision 10 Defect Inspection System.
• The Prime Vision 10 system has a nanometre-scale resolution for detecting tiny defects on the surface of wafers, as well as 3D detection technology that finds yield critical defects buried in 3D GAA structures and high-aspect-ratio memory devices.

Integrated Materials Solution

• Applied Materials focus on Integrated Materials Solutions to combine several critical processes, including atomic layer deposition (ALD), thermal steps, plasma treatment steps, and metrology, into a single, high-vacuum platform to enhance the performance and reliability of gate oxide stacks used in semiconductor manufacturing. Service providers with rich expertise in these segments would find a better opportunity to serve Applied Materials

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