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DS Smith launched an innovation center to expedite the R&D of packaging fulfillment solutions

Key Signals in Industrial

Partnerships
Vitesco and Infineon boost e-mobility efficiency partnership 
Vitesco Technologies and Infineon are expanding their collaboration to improve e-mobility efficiency. In future electric car architectures, Vitesco will use Infineon AURIX TC4x microcontrollers to improve system economy, safety, and cybersecurity. Read More>>
Airbus Helicopters partners with TRUMPF to enhance additive manufacturing capabilities
Airbus Helicopters and TRUMPF are collaborating to improve additive manufacturing capabilities by leveraging advanced 3D printing technology to produce lightweight, cost-effective, and ecologically sustainable aircraft components. Read More>>
Mips and MSA Safety announce partnership 
Mips and MSA Safety are collaborating to improve workplace safety, notably in the construction industry, by creating new helmet-based safety measures that handle rotating impacts and improve worker protection. Read More>>


Deals
The Toyota-LG agreement to manufacture batteries 
LG Energy Solution and Toyota Motor North America have agreed to a large supply arrangement for lithium-ion battery modules. Dedicated to bolstering Toyota’s BEV offering and promoting greener, more efficient mobility. Read More>>
Vitesco placed a major order for microcontrollers with Infineon 
Vitesco Technologies received a large order for microcontrollers from Infineon worth more than EUR 1 Bn (US$ 1.05 Bn). These will be employed in their future electric vehicle architectures and electrification solutions. Read More>>


Centre Setup and Expansion
JCB to open its second North American manufacturing facility 
To satisfy expanding demand and better service clients in the region, JCB plans to open its second North American manufacturing site in San Antonio, Texas, creating 1,500 jobs. The construction will commence in early 2024. Read More>>
DS Smith launched the R&D and innovation center 
R8, DS Smith’s R&D and innovation department, was established to explore innovative packaging solutions with an emphasis on sustainability. The Birmingham site includes labs, prototyping rooms, and collaboration spaces. Read More>>


Mergers and Acquisitions 
Ravicab Cables acquired a leading German cable manufacturing solution 
Ravicab Cables acquired Elegar Kerpen, an Indian cable solutions company, to broaden its product offering and global market reach. This strategic decision is intended to result in significant corporate growth. Read More>>


Product Launch
Loom Solar unveiled 5 kWh/10 kWh storage system 
In India, Loom Solar introduced its Atlanta series of energy storage solutions for homes and businesses, which include lithium iron phosphate batteries with capacities of 5 kWh and 10 kWh, as well as high-frequency solar inverters. Read More>>
Skoda launched the new Slavia Matte edition with a unique exterior 
Skoda introduced the Slavia Matte Edition, a premium car with a Carbon Steel matte appearance. It keeps the Style variation design components and provides a variety of interior features. There are two engine types and different transmissions available. Read More>>

Latest Industry Insights from Draup Braindesk

Cutting-Edge Chip Manufacturing Solutions 
  • By leveraging cutting-edge chip manufacturing solutions, Lam Research Corporation utilizes various technologies such as photolithography, plasma etching, CVD, ALD, and ion implantation to enhance semiconductor production.  
  • The company enhances advanced chip manufacturing solutions, incorporating cutting-edge technologies for high-performance semiconductor fabrication and production.  
  • Lam Research Corporation encompasses cutting-edge chip manufacturing solutions, incorporating state-of-the-art technologies and methodologies for semiconductor fabrication, ensuring high-quality and high-performance semiconductor devices.  
Advanced Packaging Solutions 
  • Lam Research Corporation offers advanced semiconductor packaging services, optimizing chip performance, reducing size, and enhancing thermal management for next-gen electronic devices.
  • The company achieves improved device density and performance through the implementation of 3D packaging, which integrates multiple semiconductor layers, enhancing overall efficiency.  

Key Funding Alert

DS Smith invested € 13 Mn in innovative packaging solutions and a significant production boost in Romania
DS Smith is investing €13 Mn in its Ghimbav production site in Romania to boost production capacity by over 20%, introduce advanced technology, and enhance manufacturing efficiency in alignment with sustainability goals. Read More>>

Startup Spotlight

Company –  UnitX 
Total Funding – USD 52 Mn
About: UnitX provides an inspection solution based on deep learning for automated manufacturing. It builds robots for factories. The company specializes in deep learning, robotics, imaging systems, and precision engineering. Read More>>

Latest Reports Published in Draup

Xerox Corporation Account Intelligence Report 
Xerox aims to make its cutting-edge products and solutions accessible to a broader range of customers by providing flexible and tailored financial programs. It offers cloud-based solutions, business process automation, and IT services. Read More>>

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