Apple signs new deal with Arm to license chip designs beyond 2040

Deals
EnSilica inks contract for e-mobility market worth over USD 7 million
EnSilica PLC has secured a supply contract valued at over USD 7 million for application-specific integrated circuits catering to the e-mobility market. The deal involves designing and supplying a mixed-signal sensor ASIC for electric vehicles, e-bikes, e-scooters, and more, with production set to start in mid-2025 and continue for at least five years. Read More>>
Apple signs new deal with Arm to license chip designs beyond 2040
Apple has a new long-term agreement with Arm, extending beyond 2040, priced at USD 52 billion. The deal ensures Apple’s continued access to Arm’s chip technology, which underpins its custom silicon processors like the A15 and M2 chips. Several other tech giants, including AMD, Google, Intel, Nvidia, Samsung, and TSMC. Read More>>

Partnership
Alchip collaborates with Arteris to expand ASIC Design Services
Arteris and Alchip Technologies are partnering to improve high-performance SoC designs, targeting AI, ADAS, vision systems, and consumer electronics. The collaboration combines Arteris’ interconnect IP solutions with Alchip’s semiconductor design and manufacturing platform to optimize SoCs for diverse market segments. Read More>>

Merger and Acquisition
Renesas to acquire Sequans to boost IoT Technology offerings
Renesas acquired Sequans in a transaction valued at USD 249 million. The acquisition aims to bolster Renesas’ IoT solutions by integrating Sequans’ cellular connectivity products and IP into its core product lineup, expanding its presence in the Wide Area Network market. Read More>>

Centre Setup and Expansion
Micron plans to set up more chip units in India
Micron Technology Inc. is set to establish semiconductor assembly and packaging units in India, bolstering the country’s position as a semiconductor manufacturing destination. This initiative follows Micron’s USD 800 million investment to set up a semiconductor assembly, testing, marking, and packaging unit in Gujarat’s Sanand. Read More>>
GlobalFoundries marks the end of USD 4 Bn expansion in Singapore
GlobalFoundries opens its USD 4 billion expansion fab in Singapore, creating 1,000 high-value jobs, mainly in technical roles. Singapore aims to become a hub for advanced manufacturing as the semiconductor market grows. Read More>>

Executive Movement
SkyWater appoints John Sakamoto as President and Chief Operating Officer
With 25 years of experience at Altera, Intel, and Marvell, Sakamoto will oversee business operations and growth strategies, focusing on the US semiconductor industry’s opportunities. Read More>>

Layoff
Nexperia plans to cut 100 jobs at Newport wafer fab
Nexperia is set to lay off 100 employees at its Newport wafer fab in the UK. The company, owned by China’s Wingtech, aims to return employment levels to those before its takeover. The wafer fab was formerly a key site for compound semiconductor research. Read More>>
Intel is also reducing its workforce
Intel is downsizing its workforce again, with 140 employees in California affected, including 89 at its Folsom headquarters and 51 at its San José headquarters. The layoffs include various positions such as software development engineers, system software development engineers, and product marketing engineers. Read More>>

• MediaTek’s cutting-edge chipsets, including the Dimensity 6000 series and Dimensity 9200+, create advanced in-vehicle AI cabin solutions and offer support for 5G broadband services through integrated AI applications. 
• MediaTek is advancing its 5G technology offerings, producing a range of 5G chipsets with advanced features and capabilities, developing solutions for wireless connectivity technologies like Wi-Fi and Bluetooth, and enabling seamless and reliable device communication. 
• MediaTek’s Dimensity 8200, a high-end 5G chipset designed for smartphones, offers flagship-level experiences, gaming improvements with HyperEngine 6.0, powerful imaging capabilities, an integrated 5G modem with 3CC carrier aggregation, and tri-band Wi-Fi 6E support, delivering impressive performance and connectivity at a competitive price. 
• MediaTek’s Kompanio 520 and Kompanio 528 chipsets, tailor-made for Chromebooks, offer enhanced computing performance, extended battery life, and improved connectivity to provide users with a seamless and efficient experience.  
• MediaTek introduces Dimensity Auto, an advanced automotive platform for intelligent, always-connected vehicles, alongside cutting-edge IoT solutions featuring AI capabilities, high-performance graphics, and seamless connectivity, including an integrated AI computing hub for smart city infrastructure.  
• MediaTek, Inc. focuses on the development and advancement of 5G technology and chipsets, producing a wide range of 5G chipsets with advanced features and capabilities for the growing demand for 5G-enabled devices and Dimensity Auto platform with high-performance computing and efficient AI processors. Service providers with rich expertise in these segments would find a better opportunity to serve MediaTek, Inc.

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