This week in Semicon: Key players bank on new acquisitions to gain IoT hardware edge
Latest Industry Insights from Draup Braindesk
Product innovations in the form of miniaturization and integration with emerging tech are driving investments in the Semicon industry.
Samsung Electro-Mechanics developed a 5G smartphone slim 3-socket MLCC to reduces high-frequency power noise. They have also developed a power inductor that supplies stable electricity to semiconductors.
Analog Devices develops innovative augmented reality applications to enable smart vehicle integration and enhance battery platform for automotive manufacturers across multiple models to improve design flexibility and manufacturability
Latest Reports Published in Draup
Broadcom Limited Corporation Account Intelligence Report: Broadcom provides next-generation high-scale monitoring operations that simplify 5G, IoT, Cloud, and SD-WAN deployments by applying AI and ML to rich granular data captured at the chip level. Read More>>
TCS Semiconductor Segment Report: Q3 FY2021 revenues amounted to USD 5.70 Bn, an increase of 5.1% Q-o-Q and 2.1% Y-o-Y due to strong demand for cloud adoption and tailwinds of large digital deals. Read More>>
Key Funding Alert
Wireless IC startup SPARK Microsystems raises USD 13.9 Mn in private equity funding.
The funding round was led by Cycle. Proceeds will be used to fund high-volume manufacturing, sales ramp and expanded R&D for next-generation products. Montreal, Canada, and founded in 2016, SPARK has raised about $17.3M. Read more>>
Company – Thruwave HQ Location – Greater Seattle Area, US Total Funding– USD 7.15 Mn Type – Semiconductor Year of Inception – 2017 About: ThruWave produces millimeter-wave imaging technology designed for markets including robotics, construction, and quality control. Read more>>
Key Insights and Signals in Semiconductor
Mergers and Acquisition SK Hynix to purchase Intel Corp’s NAND storage unit US regulators cleared SK Hynix Inc’s USD 9 Bn acquisition of Intel Corp’s NAND storage unit. The transaction proceeds will be used to advance what Intel sees as long-term growth priorities such as AI, 5G networking, and intelligent, autonomous edge products. Read More>> HEICO Corporation subsidiary acquires highly successful Pyramid Semiconductor The business will operate as a part of HEICO’s 3D PLUS USA subsidiary, which is also located in the Silicon Valley area. 3D PLUS USA supplies advanced high-density 3D microelectronic products, and die stacking and wafer-level stacking technologies for space and defense applications. Read More>> DuPont to acquire Laird Performance Materials for USD 2.3 Bn from Advent International Laird Performance Materials is a world leader in high-performance electromagnetic shielding and thermal management with a comprehensive offering of performance components and solutions that manage heat and protect devices from electromagnetic interference. Read More>> Qualcomm completes acquisition of CPU designer Nuvia The USD 1.4 Bn deal will reduce Qualcomm’s dependence on ARM, which itself is facing a USD 40 Bn takeover from Nvidia Corp. ARM’s chip is currently used in the Snapdragon™ platforms. Read More>>Partnerships NGK collaborates with Renesas to promote the widespread adoption of maintenance-free IoT devices These IoT devices use the EnerCera battery series, which is ideal as a power source for maintenance-free IoT devices since it can efficiently charge itself with a weak current and output a large intermittent current to drive functions such as sensing and communication. Read More>> MulticoreWare Inc. joins Analog Devices, Inc.’s (ADI) Alliances Partner Program The collaboration between ADI and MulticoreWare, will open doors to target new opportunities for applications involving Human Behaviour Detection and Recognition, Face Detection. Read More>> GlobalFoundries and Bosch partner on MmWave radar Semiconductor leader GlobalFoundries (GF), in partnership with Bosch, announced a joint effort to codevelop a mmWave automotive radar SoC (system on a chip) for ADAS applications. ADAS is a key component of automotive, as these systems provide varying levels of intelligence designed to keep drivers safe. Read More>> Deci and Intel Collaborate to optimize Deep Learning Inference on Intel’s CPUs The collaboration between Deci and Intel takes a significant step towards enabling deep learning inference at scale on Intel CPUs, reducing costs and latency, and enabling new deep learning inference applications. Read More>>Executive Movement James Mitarotonda joins Rambus Board of Directors Mr. Mitarotonda has extensive financial and executive leadership expertise and a significant board of director experience at public companies. Read More>>Centre Setup and Expansion ROHM and Sanden Huayu open a joint technology laboratory The two companies will continue to strengthen their collaborative relationship to accelerate the development of innovative solutions by evaluating ROHM power devices along with IPMs that combine driver ICs with peripheral components. Read More>> Product Launch Intel’s 11th-gen desktop CPUs could win gamers back from AMD Reaching speeds of up to 5.3GHz with Intel® Thermal Velocity Boost1, the Intel Core i9-11900K delivers even more performance to gamers and PC enthusiasts. Read More>>
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