This week in Semicon: Partnerships based on 5G & IoT on the upswing fuelled by a positive shift in consumer demand

Latest Industry Insights from Draup Braindesk

Emerging economies of Asia are committed to attracting FDI to strengthen the semiconductor industries and support to introduce new products and services 

  • Intel invested in ProPlus, a provider of EDA software used by the chip makers to design their products before manufacturing 

  • SK Hynix implemented an ML-based chip inspection system to improve optical proximity correction accuracy 

  • Kioxia, a spin-off company from Toshiba, has planned to invest USD 9.5 Bn to build a factory to produce NAND flash memory chips for 5G networks 

Latest Reports Published in Draup

Skyworks Solutions Account Intelligence Report – June 2021: Skyworks deployed solutions for 5G massive MIMO, small cell based stations and extended market leadership in Wi-Fi 6 and 6E solutions connectivity. Read More>>
NXP Semiconductors Account Intelligence Report – June 2021: The company is working on innovations across the segment of the connected car through edge computing, ethernet, connected platforms, and wireless charging solutions. Read More>>

Key Funding Alert

Japan’s Rohm kicks off USD 45 Mn venture fund to drive new chip tech 
Japanese chipmaker Rohm has launched a 5 billion yen (USD 45 Mn) venture capital fund to invest in next-generation semiconductor technology that can propel growth in the decades to come. 

As a first step, Rohm’s fund invested 300 million yen in US startup Locix, which provides spatial intelligence solutions for warehouses and factories. Read more>>

Startup Spotlight

Company –  iDEAL Semiconductor 
Total Funding  USD 26.76 Mn
About: iDEAL Semiconductor is a fabless semiconductor company. They are focused on delivering break-through levels of power efficiency utilizing their new proprietary, patented technology which affords advanced system designers a new palette of performance to deliver today’s and tomorrow’s industry-leading new products in all the hottest segments. Read more>>

Key Insights and Signals in Semiconductor 

Mergers and Acquisition 
Broadcom in talks to buy software firm SAS Institute 
Chip and software company Broadcom is in talks to buy SAS Institute in a deal that could value the software firm in the range of USD 15 Bn to USD 20 Bn, the Wall Street Journal reported. The acquisition could be finalized in the coming weeks. Broadcom and SAS did not immediately respond to Reuters’ requests for comment. The acquisition would help Apple Inc supplier Broadcom expand its infrastructure software solutions business. Read More>>
Austin’s Cirrus Logic acquires California tech company for USD 335 Mn
The acquisition is aimed at adding to the company’s product lines and speeding its growth. Cirrus Logic, which has about 800 local employees, makes low-power voice and audio chips for smartphones, tablets, and headphones. The company projects Lion Semiconductor will add USD 60 Mn in revenue between the close of the deal and the end of the fiscal year 2022.  Read More>>
AMD’s Xilinx acquisition enters the second phase of Chinese regulatory scrutiny     
After approval by the three major global regulatory bodies, the Chinese approval is the final stage for the affair set to cost the company USD 35 Bn and allow it to diversify its product portfolio to target emerging computing markets such as artificial intelligence, machine learning and fifth-generation (5G) cellular networks. Read More>>
China’s Wingtech buys troubled top UK chipmaker
Chinese-owned Dutch chip firm Nexperia has acquired Britain’s largest chipmaker, the financially troubled Newport Wafer Fab (NWF), a step that could further China’s ambitions to build up its sector for high-tech chips that power most modern electrical devices. With the acquisition, Nexperia obtains 100% ownership of the Welsh semiconductor production facility. Read More>>
TI to acquire Micron’s 300-mm chip factory       
Instruments Inc. Texas Instruments will acquire Micron Technology’s 300-mm semiconductor factory (fab) in Lehi, Utah, for USD 900 Mn. The Lehi fab will be TIs fourth 300-mm fab, joining DMOS6, RFAB1 and soon-to-be-completed RFAB2 in TIs wafer fab manufacturing operations. Read More>>
Sonde Health partners with Qualcomm on vocal biomarker tech     
Sonde Health has joined forces with chipmaker Qualcomm to develop a technology platform that could diagnose human health conditions from a short speech sample. The two companies will make sure that Sonde Health’s vocal biomarker platform is optimized for use with Qualcomm chips used to power 5G mobile devices, saying this could unlock several health screening and monitoring applications. Read More>>
S. Korean President Moon, Dutch PM Rutte vow to bolster collaboration on chip production
South Korean President Moon Jae-in and Dutch Prime Minister Mark Rutte pledged to bolster cooperation on semiconductor production during a virtual summit. The two nations celebrate the 60th anniversary of bilateral ties this year. The leaders vowed to tackle the global chip shortage and extend their partnership into other futuristic fields such as smart farming, city development, and hydrogen-powered vehicles. Read More>>
CEVA Logistics partners with ASM International NV to support semiconductor production growth 
CEVA Logistics has opened an in-house operations facility at ASM International NV’s global manufacturing headquarters in Singapore. ASM International NV specializes in the design and manufacturing of semiconductor wafer processing equipment for the production of semiconductor devices. All major product categories within the semiconductor field are expected to show double-digit annual growth, with the strongest increase shown in Asia Pacific, according to the World Semiconductor Trade Statistics. Read More>>
STMicroelectronics partners with Arrival on Next-Gen EVs    
Arrival’s entire electric vehicle (EV) portfolio, including its Van, Bus, and recently announced Car, will feature ST’s technologies. STMicroelectronics is collaborating with Arrival to provide leading-edge semiconductor technologies and products, including automotive microcontrollers (MCUs) and power and battery-management devices, for Arrivals electric vehicles (EVs).  STs technology will provide Arrivals customers with future-proofed zero-emission commercial vehicles as part of an integrated mobility ecosystem. Read More>>
Executive Movement  
Qualcomm appoints Don McGuire as Senior Vice President and Chief Marketing Officer 
Qualcomm Incorporated announced that Don McGuire has been appointed senior vice president and chief marketing officer (CMO), reporting directly to Cristiano Amon, president and chief executive officer of Qualcomm Incorporated, effective immediately. In this role as senior vice president, he had responsibility for Snapdragon marketing and redefined Qualcomm’s strategic approach to product marketing. Read More>>
Sandy Bridge engineering veteran returns to Intel     
Intel has rehired one of the key engineers behind its Sandy Bridge and SkyLake architecture CPUs. Shlomit Weiss has been appointed as SVP and co-general manager of the Design Engineering Group. Weiss has 26 years of experience working at Intel and only left five years ago to work for Mellanox/Nvidia, for whom she led a 1,000+ team in Israel.  Read More>>
Deals and Deal renewals
Amber signs key deal with Infineon for consumer smart power   
The first track will focus on upgrading the power management architecture in specific product categories, like smart circuit breakers, light switches, outlets, and others, to Amber and Infineon silicon-based solutions. The second parallel track will explore the integration of some of Amber’s proprietary architecture with certain Infineon product roadmaps. Read More>>
Huawei’s HiSilicon division signs a new agreement with a Chinese equipment-maker     
HiSilicon is a group within Huawei responsible for the development of this OEM’s in-house chipsets, the flagship Kirin mobile SoCs included. Therefore, the move could help Huawei circumvent the sanctions that prevent it working with US suppliers to help make its components. Read More>>
Ingram Micro signs distribution agreement to offer NVIDIA products in India and The South Asian Association for Regional Cooperation  
With this agreement, Ingram Micro India will be one of the key distributors in the region, providing its channel partners access to the complete portfolio of NVIDIA high-performance cloud and data center GPUs and embedded system solutions targeting the telecom, banking, financial services and insurance (BFSI) and other major enterprise markets. Read More>>
Ambarella’s (AMBA) CVflow Vision Processor to power Arrival’s EVs     
The CV2FS CVflow AI vision processor has been adopted by global electric vehicle (EV) manufacturer Arrival to build the environmental perception module for its vehicles. Ambarellas technology will help Arrival produce more affordable EVs and boost global mass adoption. Designed for safety-critical applications, the Ambarella CV2FS AI vision processor provides an open platform for differentiated, high-performance automotive systems, increasing the levels of autonomy. Read More>>
Center setup and Expansion
Intel plans a USD 20 Bn fab factory in Europe as EU aims to produce 20% of Worlds Semiconductors by 2030   
US chip manufacturing behemoth Intel has indicated that investment in its planned European USD 20 Bn semiconductor factory could be spread across several EU member states. Much of the world is currently dependent on Taiwan and its dominant chip manufacturing giant, TSMC, to supply chips. Intel also already announced expansion of the company’s semiconductor manufacturing capacity through two new fabrication factories in Arizona, US that will be set up at a cost of USD 20 Bn. The new factories will commence production in 2024 and Intel’s foundry will offer a United States (US) and Europe-based alternative to Asian fab factories. Read More>>
Micron begins to invest in EUV lithography facilities for DRAM production     
Micron Technology announced on June 30 that its facility investment for fiscal year 2021 (September 2020 to August 2021) will exceed USD 9.5 Bn. Micron is planning to install ASML’s new EUV lithography equipment NXE:3600D at its research facilities at the end of this year. Read More>>
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