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This week in Semicon: OEMs prep facilities for new IoT hardware solutions as cross-industry demand set to rise exponentially

Latest Industry Insights from Draup Braindesk

Semiconductor companies are focusing on the following areas:

3D Printed Electronics: Semicom players launch 3D printed electronic products and integrated circuits using 3D printing platforms. Collaborations and partnerships are made to leverage 3D printing technology. 

IoT-based Predictive Equipment Maintenance: OEMs are leveraging IoT technology for predicting potential damages by collecting data from ultrasonic and vibration sensors attached to the equipment. 

Wearables: Semiconductor companies are keen on manufacturing chipsets for wearable devices for monitoring and tracking fitness-related metrics. 

Wireless Communication: Companies are enhancing their technology capabilities such as IoT, FutureAI, and Future Quantum in order to focus on future communication technologies. 

Center Expansion: Semiconductor giants are keen on expanding their business capabilities to Ireland by developing a new center. Major companies like Intel and Microchip technology are establishing their development centers in Ireland for manufacturing semiconductor parts 

Rapid Prototyping: Semiconductor companies are focusing on using fast fabrication of a physical part, model, or assembly using 3D computer-aided design to rapidly prototype product and service concepts. 

Latest Reports Published in Draup

Micron Technology – Account Intelligence Report: Micron Technology is keen on memory and storage solutions to deliver world-class storage solutions to its data center, client customers, industrial and automotive customers. Read More>>
Microchip Technology – Account Intelligence Report: Microchip Technology focuses on enhancing storage devices and its infrastructure by adding several new-age technologies to the system for providing high-speed transfer flash and SSD drives. Read More>>

Key Funding Alert

Renesas raises USD 2 Bn in share issue to fund Dialog Semiconductor buy. 
Renesas announced in February that it would acquire UK-headquartered Dialog, a mixed-signal integrated circuit supplier. Dialog designs power, connectivity, memory and other parts for automotive, internet of things, mobile, storage and other industrial appliances. Read more>>

Startup Spotlight

Company – InnerPlant
Total Funding  USD 5.4 Mn
Year of Establishment – 2018
About: InnerPlant’s data platform increases field health and drives value throughout the supply chain. The company was founded in 2018 and is based in San Francisco, California. Read more>>

Key Insights and Signals in Semiconductor 

Partenerships
Precise and Qualcomm announce new partnership: 
They are coming together to use Precise BioMatch with Qualcomm’s ultrasonic under-display biometric sensors earlier this year. The partners were selected by Meizu for a pair of 5G smartphones. Read More>>
Ambarella, Lumentum, ON Semiconductor partner on AI-based 3D sensing: 
By combining the data from Lumentum’s VCSEL array illuminators and an ON Semiconductor image sensor using Ambarella’s AI system on chip (SoC), the partners say that more intelligent decision-making can be achieved in next-gen AIoT devices for biometric access control, 3D electronic locks and other sensing applications. Read More>>
Qualcomm (QCOM) rides on Snapdragon strength, partnerships
The firms are undertaking rapid innovations despite an acute shortage of chips, with the semiconductor supply chain significantly affected by the pandemic. Markedly, Qualcomm is touted as a global frontrunner in the development and commercialization of fundamental technologies for the wireless industry. Read More>>
Microsoft teams up with Qualcomm on ARM kit 
This developer kit provides an affordable alternative to other consumer and commercial devices. With the smaller desktop configuration, this kit gives developers more flexibility than notebook options and at a lower price point. Read More>>
Centre Setup and Expansion
AT&S is investing USD 137 Mn in the company’s headquarters in Austra 
Around USD 121 Mn  are to be spent on new machinery and processing, and the remainder will go into research and development, said AT&S, which produces circuit boards for smartphones and tablets and supplies the likes of Apple and IntelRead More>>
Executive Movement
New CEO to drive Maxim Investment Group towards a new strategic direction
The company announced the appointment of Mohamed Samir El Sayed as the CEO to assume the responsibility of standardizing functional processes across the business; driving growth, both organically and through joint venture; and directing the group’s expansion across the sectors. Read More>>
NXP Semiconductors appoints Joe Kaeser as Vice-Chair of the Board
 Mr. Kaeser has served as a non-executive director and highly valued member of NXP’s Board since 2010 and is a member of NXP’s Nominating & Governance Committee. Mr. Kaeser formerly served as President and Chief Executive Officer of Siemens AG. Read More>>
Mass Hiring:
ZEISS announces relocation of US headquarters, completion of new lab
This move will centralize the company’s operations with its main US optical laboratory. San Diego-based employees will continue to work remotely. ZEISS has operated the Kentucky facility since 2001 and currently employs close to 400 people at this location. Read More>>
Deals
AMD is borrowing a key Intel feature for its next-gen chips
AMD’s upcoming AM5 socket will reportedly use a different socket design. The next generation of AMD processors will use a land grid array (LGA) socket instead of a pin grid array (PGA) socket, which AMD is currently using with its Ryzen 5000 range and has traditionally used throughout processor generations. Read More>>
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