Jaguar Land Rover partners with Nvidia for autonomous driving and connected services

Key Insights and Signals in Semiconductor

Centre Setup and Expansion
Qualcomm pushes Europe XR with new labs  
The company made a major extended reality (XR) play in Europe, opening new laboratories across six cities as part of a commitment to boost R&D and engineering and further increase access to the technology. Read More>>
Intel nears USD 5.4 Bn deal to buy Tower Semiconductor  
The potential purchase would deepen Intel’s presence in a space dominated by Taiwan-based TSMC, the world’s largest contract chipmaker. Read More>>
AMD acquires Xilinx in a record chip industry deal  
With the Xilinx acquisition, AMD will be able to increase its breadth in key markets like data centers where Xilinx has a strong network and AI presence, as well as in the 5G communications, automotive, industrial, aerospace, and defense markets. Read More>>
Qualcomm and Hewlett Packard Enterprises to collaborate for 5G innovation  
This joint venture between Qualcomm and HPE aims to bring the next generation of 5G distributed units to enterprises as the need for 5G deployment continues to grow. Read More>>
DynamoEdge and Tessolve partner on end-to-end mobility solutions  
The new solution offers scalability to millions of consumers and devices while providing the flexibility to enrich data anywhere. The companies involved expect the solution to support a broad array of use cases, including autonomous vehicles, connected cars, first responders, 5G sports, and entertainment. Read More>>
JLR partners with Nvidia for automated driving systems 
Starting 2025, all Jaguar and Land Rover cars will be built on the Nvidia Drive. This software-defined platform will equip the vehicles with a raft of active safety systems, automated driving, and parking systems, as well as advanced driver assistance systems (ADAS). Read More>>
VMware, Nvidia team up on AI-powered hybrid cloud platform 
This recent announcement is an extended collaboration between the companies that will see Nvidia’s AI Enterprise Suite integrated into the VMware Cloud Foundation (VCF) 4.4 platform to enable faster deployments of AI solutions. Read More>>
Executive Movement 
Intel hires HP’s Christoph Schell as Chief Commercial Officer 
Schell will be joining Intel after working a total of 25 years for HP, where he became the PC and print giant’s first-ever chief commercial officer in November 2019. Read More>>
Infineon names Rutger Wijburg as Chief Operations Officer 
The succession plan was approved last week by Infineon’s supervisory board, who gave Hanebeck a five-year contract until March 31, 2027. Read More>>
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Key Funding Alert

Infineon invests over USD 2 Bn in Malaysia front-end fab 
Infineon Technologies AG is strengthening its market leadership in power semiconductors by adding significant manufacturing capacities in the field of wide bandgap (SiC and GaN) semiconductors. The USD 2 Bn investment will help the semiconductor manufacturer build a development competence center in Villach and cost-effective production in Kulim for wide bandgap power semiconductors. Read more>>

Startup Spotlight

Company – Iridia
Total Funding  USD 40.07 Mn
About: Iridia is a nanotechnology company specializing in biochemistry, molecular biology, and DNA. It developed the world’s first commercially attractive DNA-based data storage solution that combines DNA polymer synthesis technology, electronic nano-switches, and semiconductor fabrication technologies. Read more>>

Latest Reports Published in Draup

Wolfspeed Account Intelligence Report: Wolfspeed focuses on manufacturing silicon carbide Schottky diodes, MOSFETs, power modules, and RF products for use in aerospace, defense, and communication infrastructure areas. Read More>>

Latest Industry Insights from Draup Braindesk

TSMC Account Intelligence Report: 
  • TSMC collaborated with Broadcom to enhance the Chip-on-Wafer-on-Substrate (CoWoS) platform that supports the industry’s first and largest 2X reticle size interposer. It supports TSMC’s next-generation five nanometers (N5) process technology. 
  • Synopsys collaborated with TSMC to use the TSMC Open Innovation Platform for advanced system-on-chip (SoC) and 3DIC design enablement. 
  • Cadence Design Systems partnered with TSMC and Microsoft to utilize cloud infrastructure to accelerate digital timing signoff. It helps common customers can accelerate their signoff schedule and reduce compute costs.

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