Intel Ropes in ASML to Advance its 2nm Processing Technology as the Race with TSMC Heats Up
Key Insights and Signals in Semiconductor
Centre Setup and Expansion Toshiba to invest USD 1 Bn to double power chip production The Japanese industrial conglomerate will build a cutting-edge 300-millimeter fabrication plant in central Japan for power management chips, which efficiently control electric power in cars, electronic devices, and industrial equipment. Read More>> Intel’s USD 20 Bn Ohio Factory could become the world’s largest chip plant The initial USD 20 Bn investment on a 1,000-acre site in New Albany will create 3,000 jobs. This could grow to USD 100 Bn with eight total fabrication plants and would be the largest investment on record in Ohio. Read More>>Deal NVIDIA signs a deal to develop AI talent in Indonesia NVIDIA will be assisting Indonesia in its digital transformation through access to its Deep Learning Institute and teaching kits as well as engaging with developers on industry translational projects, conducting partner workshops on its AI software stacks, and hosting boot camps. Read More>> Intel picks ASML to help against the TSMC competition The company has placed its first order with ASML Holding NV to purchase the semiconductor industry’s first TWINSCAN EXE: 5200 system, as the US chip giant aims to compete with Taiwan Semiconductor Manufacturing Co. in advancing to 2-nanometer process technology. Read More>>Partnerships Ferrari and Qualcomm aim to accelerate Ferrari’s digitalization The agreement with Qualcomm Technologies will have a strong technological impact on the digital transformation process for Ferrari and its road cars. Starting from common projects such as the digital cockpit, the two companies will explore new opportunities and a range of technological solutions. Read More>> Ventana Micro Systems announces a strategic partnership with Intel The partnership intends to make Ventana’s RISC-V CPU cores available through Intel Foundry Services to leading customers in the Data Center, 5G/Edge, Networking, Storage, AI/ML, Automotive, and Client market verticals. Read More>> CAES collaborates with Lattice Semiconductor As part of the agreement, CAES will qualify and sell radiation-tolerant Lattice FPGAs for space and satellite applications. The collaboration will allow CAES to provide next-generation on-orbit reconfigurable processing systems for future satellite constellations. Read More>> Qualcomm enables Edge Voice Processing with SoundHound Qualcomm is teaming up with SoundHound to bring better voice features to Android smartphones. For its part, Qualcomm is planning to install SoundHound’s tech on select Snapdragon chipsets that will eventually be deployed in future Android devices. Read More>> Ontex, Semtech collaborate on IoT-Enabled Diaper Tag Ontex developed and owns the smart diaper concept and worked with Belgian medical device agency Zenso Electronics to seamlessly integrate Semtech’s LoRa devices and the LoRaWAN standard to alert caregivers via an app when the pad needs to be changed. Read More>>Executive Movement Impinj promotes Hussein Mecklai to Chief Operating Officer In his expanded role, Mecklai is directly responsible for Impinj’s engineering and operations. Hussein has helped Impinj reinvent product performance, integration, and ease of use. Read More>> Intel hires Microsoft Exec to lead Global Partner Sales Alyssa Fitzpatrick will have a particular focus on system integrators, cloud partners, and independent software vendors in her new job. Before joining Intel, Fitzpatrick was general manager of worldwide partner sales for Microsoft. Read More>>
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Key Funding Alert
Wolfspeed raises USD 650 Mn, ups capital raise by USD 150 Mn
Wolfspeed is turning to investors to raise USD 650 Mn in a debt fundraiser. That is USD 150 Mn more than originally reported and is a reaction to interest in the notes. Of the total capital raise, Wolfspeed would use close to USD 94 Mn for capped call transactions. Read more>>
Company – Empower Semiconductor Total Funding– USD 45 Mn About: Empower Semiconductor is dedicated to enabling the design of high-efficiency, integrated voltage regulators (VR) in SoCs. Empower’s world-class team has developed a patent-pending power management architecture that is redefining the cost, size, and energy efficiency of voltage regulators for a variety of applications. Read more>>
Latest Reports Published in Draup
Wolfspeed Account Intelligence Report
Wolfspeed focuses on manufacturing silicon carbide Schottky diodes, MOSFETs, power modules, RF products for use in areas including aerospace, defense, and communication infrastructure. Read More>>
TSMC Account Intelligence Report
TSMC aims to modernize infrastructure and enable digital portfolios through the integration of platform and enabling hybrid semiconductors for industries. Read More>>
Latest Industry Insights from Draup Braindesk
TSMC Account Intelligence Report:
TSMC collaborated with Broadcom to enhance the Chip-on-Wafer-on-Substrate (CoWoS) platform that supports the industry’s first and largest 2X reticle size interposer.
Synopsys collaborated with TSMC to use the TSMC Open Innovation Platform for advanced system-on-chip (SoC) and 3DIC design enablement.
NXP Semiconductors partnered with TSMC to adopt TSMC’s 5-nanometer (5nm) technology for NXP’s automotive platform.
Cadence Design Systems partnered with TSMC and Microsoft to utilize cloud infrastructure to accelerate digital timing signoff.
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