Hugging Face partners with Qualcomm Technologies to enable transformers for Qualcomm Cloud AI 100
Key Insights and Signals in Semiconductor
Deal BAE Systems set to expand the domestic supply of state-of-the-art microelectronics technology BAE Systems has been awarded a USD 60 Mn contract from the Army Contracting Command Rock Island under the Cornerstone Other Transaction Authority to develop certain next-generation, radiation-hardened by design (RHBD) microelectronics leveraging Intel Corporations commercial foundry Intel Foundry Services. Read More>> Intel orders ASML system in the quest for chipmaking edge Intel has placed the first order with ASML for a new, advanced chipmaking tool that will cost more than USD 340 Mn. The move reportedly comes after several semiconductor manufacturers are looking to get ahead in this booming industry. Read More>>Partnerships Du and Intel collaborate to enable digital transformation The new enterprise connectivity solution, which will include a RAN Intelligent Controller (RIC) and cost-efficient open-source 5G core network, aims to reduce the total cost of ownership and accelerate the process of digitalization for Du’s enterprise and government customers. Read More>> Hugging Face partners with Qualcomm Technologies to enable transformers for Qualcomm Cloud AI 100 With this extended collaboration with Qualcomm Technologies, Hugging Face will be connecting the ultimate transformer toolset with power-efficient AI hardware, enabling better TCO for inferencing in the cloud as well as the edge. Read More>> Mincom and Sanmina’s Advanced Microsystems Technologies division collaborate to develop 5G mmWave solutions The division will provide design, packaging, assembly, and testing services that integrate MixComm’s low power and beamforming chips into an innovative AiP package that simplifies and miniaturizes the product design. Read More>> Semtech and Lacuna Space add IoT-to-Satellite connectivity to LoRaWAN The collaboration is built on Long Range Frequency Hopping Spread Spectrum (LR-FHSS), the latest addition to the LoRaWAN standard. Lacuna’s application of this affordable and simplified technology will further expand access to connection through their satellite technology. Read More>>Mergers and Acquisition TT Electronics acquires Ferranti Technologies business for USD 9 Mn The acquisition adds technology capabilities, intellectual property, and highly skilled employees who provide full-service capabilities to TT’s Power Solutions business. Read More>>Executive Movement Toshiba appoints Andrew McDaniel as Managing Director and SVP of Europe McDaniel will assume leadership of all European operations, reporting to Rance Poehler, global president and CEO, Toshiba Global Commerce Solutions. Read More>> Bitfury Group appoints former Intel Senior Director Chandra S. Katta as Chief Technology Officer Mr. Katta oversees Bitfury’s technological innovation and integration across all domains of the Web 3 ecosystem, leading a team that develops proprietary chip technology, Bitcoin mining equipment, and other hardware and software infrastructure. Read More>>
Latest Industry Insights from Draup Braindesk
Silicon Labs Account Intelligence Report:
The company focuses on technologies that simplify and accelerate adoption by customers with high security features such as Secure Boot, Secure Debug, Secure OTA bootloader, and customer specific keys
It is looking to strengthen its capabilities in wireless connectivity and the IoT products which are susceptible to cyber-attacks and intends to connect smart devices throughout the communities
Unify Software Development Kit provides the common building blocks for connectivity across IoT ecosystems and accelerates time-to-market, streamlines maintenance and future-proofs investments by simplifying the process for updates
Product Engineering Services is the highly outsourced segment, holds approximately 83% of total outsourcing headcount. eInfochips is the key strategic outsourcing partner for Silicon Labs
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Key Funding Alert
Intel to invest up to USD 100 Bn in Ohio chip units
The move is part of chief executive officer Pat Gelsinger’s strategy to restore Intel’s dominance in chip making and reduce America’s reliance on Asian manufacturing hubs, which have a tight hold on the market. An initial USD 20 Bn investment — the largest in Ohio’s history — on a 1,000-acre site in New Albany will generate 3,000 jobs. Read more>>
Company – SiLC Technologies Total Funding– USD 29 Mn About: SiLC Technologies is a Silicon Photonics start up focusing on photonic Sensor and 3D imaging applications. It develops new and novel technologies and integrated solutions to address the growing needs of an autonomous and smart new world. Read more>>
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