This week in Semicon: Growing chip shortage prompts key players to build strategic partnerships with manufacturers

Latest Industry Insights from Draup Braindesk

North American Semiconductor Footprint & Key strategic priorities: 

  • Nvidia and VMware have partnered on a major artificial intelligence deal in which VMware will make its data center software compatible with Nvidia’s computer chips tailored for deep learning.  
  • LG Electronics announced that the company would be collaborating with US chipmaker Qualcomm Technologies Inc. for the development of 5G automotive platforms  
  • Marvell MRVL recently announced a partnership with Analog Devices ADI to offer highly integrated 5G radio solutions. Per the agreement, Marvell will integrate its 5G digital platform with Analog Devices’ wideband RF transceiver technology to provide digital front-end ASIC solutions with tightly coupled RF transceivers to 5G OEMs.  
  • Sony Semiconductor Solutions (Sony) and Microsoft Corp. (Microsoft) recently announced they are partnering to create solutions that make AI-powered smart cameras and video analytics easier to access and deploy for their mutual customers 

Latest Reports Published in Draup

Applied Materials Group Account Intelligence Report: Applied Materials focuses on the development of Actionable Insight Accelerator, which enables real-time semiconductor processes to solve increasingly complex challenges of the industry. Read More>>
Intel Account Intelligence Report: Intel continues to expand its market portfolio driven by AI-enabled solutions and high-performance processors for laptops and aims to improve its semiconductor manufacturing process by the opening of new manufacturing centers. Read More>>

Key Funding Alert

NVIDIA invests in VAST Data’s USD 83 Mn D round, and bumps its valuation to USD 3.7 Bn
VAST Data’s managed storage platform is the first to be based on flash – the technology that basically controls private market data storage. The company’s technology makes flash infrastructure more accessible for all data types while making hard drives and other data storage management systems redundant. Read more>>

Startup Spotlight

Company – Levels
Total Funding  USD 12 Mn
HQ Location – Greater New York City Area, US
Year of Establishment – 2019
About: Levels develops a health and wellness platform designed to monitor metabolic fitness. The platform tracks blood glucose in real-time, enabling users to optimize their diet and exercise. Read more>>

Key Insights and Signals in Semiconductor 

Center Setup and Expansion
Intel to build more Oregon factories:
New Intel CEO Pat Gelsinger said the company isn’t done expanding in Oregon and expects to add to its local manufacturing footprint again within the next few years. The company is also expanding into contract manufacturing, offering up Intel factories to build chips for other companies. Read More>>
Samsung SDI reportedly planning to build a battery plant in the US
The South Korean storage battery manufacturing company already has its own factory in the region but this is for assembling battery packs. This facility is located in Michigan and there is a possibility that the battery cell plant could be built around this area as well if things go as planned. Read More>>
Deals and Deal Renewal
AMD and GF reach a lock-in deal on wafer capacity through 2024 amid chip shortage
A previous Wafer Supply agreement between AMD and GF had required the companies to mutually agree on wafer purchase targets and wafer pricing beyond 2021. In the new amendment, GF agreed to a minimum allocation of 12 nm and 14 nm wafer nodes through December 31, 2024. Read More>>
Showa Denko secures wafer supply deal with power chip leader Infineon
The supply deal comes amid rising global demand for power semiconductors as a key component in technologies for reducing global dependence on fossil fuels. The two companies will also collaborate in developing SiC materials. Read More>>
Abside Networks selects Xilinx RFSOC DFE and Versal Devices for its new 5G Massive MIMO Solution
Working with Xilinx parts enables Abside to leverage the low power, integration level, and cost benefits of working with 7nm and 16nm parts in the 5G Radio Units. Abside’s Massive MIMO solutions 5G RAN solutions are available for immediate pre-order for delivery at the end of 2021. Read More>>
Executive Movement
Cohu appoints Yon Jorden to its Board of Directors
Ms. Jorden is also a board leadership fellow of the National Association of Corporate Directors. Ms. Jorden brings to Cohu’s Board of Directors extensive experience as a Chief Financial Officer and board member of public corporations in the technology, manufacturing, and healthcare industries. Read More>>
Digi appoints Risbakk as new CFO
Otto Risbakk is currently the CFO at Telenor Denmark and has been with the company for 13 years, previously taking on the role of senior VP for mergers and acquisitions. Otto is a highly experienced finance leader with a deep track record in Telenor and the telecoms industry, and he will add a new dimension to Digi’s management team. Read More>>
NXP Semiconductors names Andy Micallef as Executive Vice President, Global Operations
In this role, Micallef will be responsible for executing NXP’s end-to-end manufacturing, quality, and supply chain strategies. Micallef, formerly Chief Operations Officer at Marvell Semiconductor, replaces David Reed, who has decided to retire from NXP. Micallef will report directly to NXP President and Chief Executive Officer Kurt Sievers. Read More>>
Dialog Semiconductor selected as SiFive preferred power management partner
Dialog is SiFive’s preferred power management partner for its HiFive Unmatched, a PC form-factor RISC-V Linux Development Platform for the SiFive Freedom U740 RISC-V SoC. Read More>>
Vodafone and Qualcomm jointly developing a blueprint for suppliers to build future 5G networks using Open RAN
The move aims to lower the entry barrier for many companies and drive diversification of network equipment vendors. Customers will benefit as Vodafone and other telecommunications companies mix and match hardware and software from a choice of suppliers to more easily extend 5G networks in specific geographical areas where they are most needed. Read More>>
Semtech collaborates with Intel to develop LiDAR technology
The collaboration between Intel RealSense technology and Semtech’s Signal Integrity Products Group has focused on enabling the L515 camera to work in a very low signal-to-noise ratio (SNR) environments. Read More>>
Mergers and Acquisitions
ZEISS to acquire Capture 3D to extend its industry expertise in 3D measurement and inspection solutions
Once the transaction is complete, Capture 3D will become part of the Industrial Quality Solutions strategic business unit within the ZEISS Industrial Quality & Research segment.  Read More>>
Qorvo acquires leading MEMS-based sensor solution provider NextInput
The acquisition of NextInput expands Qorvo’s technology portfolio and enables Qorvo to accelerate the deployment of force-sensing solutions utilizing MEMS-based sensors. NextInput will be part of Qorvo’s Mobile Products and will be led by NextInput CEO and Founder Ali Foughi. Read More>>
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