This week in Semicon: Chip shortages & demand for AI chips fuel ambitious global expansion drives by manufacturers

Latest Industry Insights from Draup Braindesk

The emergence of Artificial Intelligence, Internet of Things, and Machine Learning technologies provides new opportunities by increasing demand for faster and advanced memory chips in industrial applications. Rising adoption of autonomous vehicles, transition to the Internet of Things era, increased demand for AI solutions, and higher growth of 5G and Augmented Reality applications are the growth drivers of the semiconductor market. 

  • Sony Corporation focuses on enhancing AI-powered smart cameras and video analytics to make video analytics solutions more accessible to drive better business outcomes 
  • Applied Materials Inc collaborated with SanDisk, coupled with the physical and control systems of the automated guided/robotic vehicle (AGV/ARV) system to reduce variability, operator errors, and delays. 

  • Intel developed Predictive Maintenance (PdM) by using IoT technology as a machine vision to gather data from equipment, vehicles, or other assets, automating the task of monitoring equipment. 

  • LAM Research Corporation launched Vantex; the latest dielectric etch technology designed specifically for Sense.i, to deliver current and future generation NAND and DRAM memory devices 

  • NVIDIA to acquire DeepMap, enhancing mapping solutions for the autonomous vehicle industry. 

  • Analog Devices announces long-reach industrial ethernet offerings to achieve last-mile connectivity in process, factory, and building automation.

Latest Reports Published in Draup

Sony Corporation Account Intelligence Report: Sony Corporation focuses on enhancing AI-powered smart cameras and video analytics to make video analytics solutions more accessible to drive better business outcomes. Read More>>
Carl Zeiss AG Account Intelligence Report: ZEISS focuses on leveraging cloud-based connectivity option which gives access to IOL calculation reports on doctor’s mobile device and allows the report to transfer surgical planning data via the cloud to the operating room. Read More>>

Key Funding Alert

Israeli chip startup NextSilicon announces over USD 200 Mn in funding and USD 1.5 billion valuation.
NextSilicon collaborates with the largest computing centers in the world using supercomputers to pursue advanced scientific breakthroughs in the fields of molecular dynamics, DNA sequencing, clean energy, and natural disasters, to name a few. Read more>>

Startup Spotlight

Company – Odyssey Semiconductor Technologies
Total Funding  USD 7.5 Mn
HQ Location – Ithaca, New York Area, USA
Year of Establishment – 2019
About: Odyssey Semiconductor Technologies is a semiconductor device company developing high-voltage power switching components and systems. Read more>>

Key Insights and Signals in Semiconductor 

Centre Setup and Expansion
German state of Bavaria in talks with Intel on mega chip factory
In recent months, the U.S. chipmaker has been seeking 8 billion euros (USD 9.5 Bn) in public subsidies to build a semiconductor manufacturing site in Europe. A shortage of semiconductors is causing headwinds for Europe’s car manufacturers and threatens to derail Germany’s economic recovery from the coronavirus pandemic. Read More>>
Belgium’s Melexis to open USD 89 Mn plant expansion in Bulgaria’s Sofia
The new building will add 15,000 sq m to the existing 7,500 sq m facility in Sofia in which Melexis operates. The new building will be housing production, R&D and warehousing units. The opening of the new plant aims to attract both Bulgarian and international specialists in microelectronics. Read More>>
Chipmaker GlobalFoundries plans USD 6 Bn expansion in Singapore, US, Germany
The U.S.-based company, owned by Abu Dhabi’s state-owned fund Mubadala, said it would invest more than USD 4 Bn in Singapore and USD 1 Bn each in the others over the next two years. The factory will make chips for cars and 5G technology, with long-term customer agreements already in place.
Read More>>
Deals and Deal Renewal
Google’s cloud taps AMD for new service as chip wars heat up
Advanced Micro Devices Inc and Alphabet Inc’s Google Cloud said Google will offer cloud computing services based on AMD’s newest data center chip, a move likely to intensify AMD’s push to grab market share from rival Intel Corp. Read More>>
Gaussin selects Nvidia Drive AGX for 100% hydrogen or all-electric ‘skateboard’
Gaussin has selected the Nvidia Drive AGX Xavier platform to power its centralized intelligent driving system for its new, 100% hydrogen or all-electric ‘skateboard’ designed for class eight tractors and straight trucks. This allows Gaussin to centralize its hydrogen skateboard architecture, facilitating the integration of systems and opening doors to AI-powered solutions using a single framework and interface.
Read More>>
STMicroelectronics delivers first Stellar Advanced Automotive Microcontrollers for New Road-Car Projects
The devices feature hardware-based virtualization, which allows multiple software applications to coexist safely while preserving performance and ensuring real-time determinism. This enhances flexibility for designers by allowing multiple independent applications or virtual Electronic Control Units (ECUs) in the same physical MCU. Read More>>
Intel and partners build 5G smart factory to demonstrate Industry 4.0 benefits
The end-to-end smart factory is based in Verona, Italy, and is based on Intel Atom and Xeon Scalable processors, Intel FPGAs, and Intel Edge Controls for Industrial and Edge Insights for Industrial software. Intel is collaborating with EXOR International, JMA Wireless, and Telecom Italia (TIM) on the project.
Read More>>
photonicSENS and Qualcomm collaborate on high-resolution single-lens 3D depth-cameras
With a complete reference design based on the Qualcomm® Snapdragon™ 888 5G Mobile Platform, smartphone manufacturers can benefit from dramatic enhancements in depth map resolution for front-facing applications like enhanced face authentication and rear-facing applications, including 3D reconstruction, enhanced bokeh, one-shot macro photography with 3D-reconstruction and printing of small objects and augmented reality (AR). Read More>>
Renault Group and STMicroelectronics enter strategic cooperation on power electronics
The cooperation focuses on packaging solutions for the power electronics systems of battery-operated and hybrid vehicles. These technologies will significantly impact electric vehicles’ driving range and charging by reducing power losses and improving efficiency, resulting in lower battery costs, more kilometers per charge, shorter charging time, and reduced user cost. Read More>>
Mergers and Acquisitions
Rambus to acquire AnalogX, accelerating next-generation data center interface solutions
This acquisition augments the Rambus family of PCIe 5.0 and 32G Multi-protocol PHYs with SerDes technology specifically built for ultra-low power and very low latency, expanding the addressable applications and available process nodes. The transaction is expected to close in the third calendar quarter of 2021. Read More>>
Cohu completes the sale of its printed circuit board test business to Mycronic AB
In accordance with the previously announced definitive agreement, Cohu received cash proceeds of USD 125.4 Mn. Cohu intends to use the net proceeds, after estimated transaction costs and taxes, to repay approximately USD 100 Mn of the outstanding principal on its term loan facility. Read More>>
Executive Movement
Intel makes organizational changes to strengthen execution, innovation in critical business areas
  1. Sandra Rivera will take on a new role as Executive Vice President and General Manager of Datacenter and AI.  
  2. Nick McKeown will join Intel full-time on July 6 as Senior Vice President and General Manager of the new Network and Edge Group.  
  3. Greg Lavender has joined Intel as chief technology officer (CTO) and Senior Vice President and General Manager of the new Software and Advanced Technology Group.  
  4. Raja Koduri, a well-known innovator in GPU computing technology, will lead the Accelerated Computing Systems and Graphics Group, a newly formed business unit that will increase the company’s focus in the key growth areas of high-performance computing and graphics. 
    Read More>>
Toshiba CEO Tsunakawa named interim chairman after investors oust Nagayama
Tsunakawa’s appointment came after shareholders delivered a clear message to management by voting out Osamu Nagayama as chairman and another director over the handling of the scandal, which has put Japan’s corporate governance under the microscope. Read More>>
Rigaku names Toshiyuki Ikeda as new President and CEO succeeding Hikaru Shimura
Mr. Ikeda, former CEO of Hitachi High-Tech Science Corporation and later CTO and Managing Director of its parent company Hitachi High-Tech Corporation, is an industry veteran in scientific instrumentation. Read More>>
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