This week in Semicon: AI & IoT market growth drives Semicon players to invest in partnerships & center expansion
Latest Industry Insights from Draup Braindesk
The development of integrated solutions with AI and IoT is proliferating in every industry,
directly influencing the growth of the chip manufacturing market by both value and volume.
Analog Devices partnered with Maxim Integrated for designing electronic chips and integrated circuits by way of 3D modeling with computer-aided design software
SK Hynix developed AI chips that come under a new generation of microprocessors specifically designed to process artificial intelligence tasks
Toshiba introduced two cobots – Humanoid and SCARA for allowing manufacturers to benefit from a combination of automated and manual processes for electronics handling and packaging applications
Product Design & Development and Supply Chain is highly fragmented, owing to several players who provide different solutions. AI & IoT may offer a solution to this problem.
Lattice implemented AI in devices using vision and sound as sensory inputs. This rapid prototyping board, in the Arduino form factor, to quickly develop always-on, low-power smart IoT devices
Toshiba implemented Dematic Modular Goods-to-Person (mGTP) system, which is used for storage, replenishment, and picking
Intel collaborated with Honeywell to develop IoT solutions for the retail sector to enhance logistics and boost supply chain performance.
The semiconductor industry is increasingly discovering that the cloud is the only viable option for delivering the robust DevOps, microservices, protection, and network designs needed to operate complex ecosystems effectively.
TSMC is expected to invest USD 100 Bn over the next three years to support advanced semiconductor technology manufacturing and R&D. TSMC has developed N12e specifically for AI-enabled IoT and other high-efficiency, high-performance edge devices.
Intel concentrated on improving chip logic and packaging technologies in order to “enhance the competitiveness of the US semiconductor industry and support key US government initiatives.” Intel is investing USD 20 Bn in the construction of two new chip plants in Arizona
Latest Reports Published in Draup
Harman – Semiconductor Segment Analysis: Harman provides end-to-end software engineering, IoT, silicon, and embedded technology and data analytics services unlocking new opportunities. Harman’s Silicon and devices technologies offer end-to-end services in SOC development, virtual and physical prototyping, IC testing & validation, and board design.
Read More>>
Broadcom Limited Corporation Account Intelligence Report: Broadcom provides next-generation high-scale monitoring operations that simplify 5G, IoT, Cloud, and SD-WAN deployments by applying AI and ML to rich granular data captured at the chip level— enabling a unique automated AI-driven solution that remediates network congestion. Read More>>
Key Funding Alert
Hero Electronix’s portfolio company Tessolve raises USD 40 Mn from Novo Tellus Capital Partners
The funding raised will be strategically deployed by Tessolve to strengthen its capabilities across chip design and embedded services offerings and expand its ASIC design business. Furthermore, the company plans to scale up its India operations by further investing in local talent development and strengthen its global presence in key markets across the US, Europe, Southeast Asia, Korea, and Japan. Read more>>
Startup Spotlight
Company – Piavita Total Funding– USD 14.26 Mn Vertical– Semiconductor About: Piavita is a Swiss-born med-tech company with a mission to transform veterinary care. They partnered with veterinarians and researchers to develop a truly unique, hardware-enabled software solution for a completely non-invasive approach to vital sign monitoring. Read more>>
Key Insights and Signals in Semiconductor
Center Expansion and New Centre set-up Intel to invest USD 600 Mn to expand chip, Mobileye R&D in Israel Intel is investing USD 400 Mn to turn its Mobileye unit headquartered in Jerusalem into an R&D campus for developing self-driving car technologies. Another USD 200 Mn will be invested in building an R&D center, called IDC12, in the northern port city of Haifa next to its current development center. Read More>> GlobalFoundries moves headquarters to its fab in New York The new HQ is home to its Fab 8 semiconductor manufacturing plant, the company’s most advanced factory. GF’s Fab 8 in New York is a USD 15 Bn advanced semiconductor manufacturing facility and is playing a key role in transforming the industry to meet rapidly accelerating demand. Read More>>Deals and Deal Renewal RS extends global franchise agreement with STMicroelectronics In what is being described as a new phase in the relationship between the two companies, there will be a substantial increase in the breadth and volume of ST products stocked by RS. ST will also feature regularly on the DesignSpark online engineering hub. Read More>>Executive Movement Micron Technology, Inc. announced the appointment of Sharawn Connors to the role of Chief Diversity and Inclusion Officer Connors joined Micron in July 2019 as the vice president of Diversity, Equality, and Inclusion (DEI). Under Connors’ leadership, Micron established six key DEI commitments for fiscal year 2021, integrated global initiatives in the company’s business and operations, and set strategy-driven goals around diverse hiring, talent retention and advancement, and inclusion. Read More>> Silicon Labs, announced the appointment of Daniel Cooley as Chief Technology Officer Cooley is an industry-respected IoT technology visionary and has been instrumental in building the unmatched breadth and depth of the company’s wireless connectivity portfolio. Read More>> Brandon Hoffman has been named Intel 471’s first Chief Information Security Officer (CISO), reporting to the company’s CEO Hoffman has nearly 20 years of experience in cybersecurity. Most recently, he served as CISO and head of security strategy at Netenrich, an IT service management company helping businesses accelerate digital IT transformation to drive outcomes across ITOps, cybersecurity, networks, and cloud. Read More>>Partnerships US taps Apple, Google, Nokia, Qualcomm for 6G boost The US National Science Foundation (NSF) took aim at 6G with the launch of its single largest public-private partnership program, enlisting nine cloud, tech and telecom heavyweights to help academics develop the technologies that will define next-generation networks. Partners in the newly unveiled Resilient and Intelligent Next-Generation Systems (RINGS) program include Apple, Ericsson, Google, IBM, Intel, Microsoft, Nokia, Qualcomm and VMware. Read More>> Intel, Samsung team up for new PCs, chip microarchitecture The two companies are embarking on a new co-engineering and co-marketing partnership for PCs they say will push the envelope on mobility, connectivity, and performance. Some of the PCs will feature a new chip microarchitecture utilizing different kinds of Intel silicon.Read More>> UK AI chip designer Graphcore has joined a European project to create a supercomputing framework for emerging AI applications in the real world The €2.6m three-year SparCity project will focus specifically on sparse AI, where there is not much correlation in the data. The tools developed during the project will be used to demonstrate the effectiveness of the framework in four real-world areas: computational cardiology, social networks, bioinformatics, and autonomous driving. Read More>>Mergers and Acquisitions Skyworks Solutions to buy Silicon Laboratories infrastructure and automotive unit for USD 2.75 Bn in cash Skyworks expects the acquisition to be immediately accretive to its earnings after it closes in the third quarter of 2021.Read More>> Brooks Automation, Inc. to acquire Precise Automation, Inc., a leading developer of collaborative robots and automation sub-systems The total cash purchase price for the acquisition will be approximately USD 70 Mn, subject to working capital and other adjustments. The transaction is expected to close by the end of April upon satisfaction of customary closing conditions.Read More>> Marvell Technology has completed its acquisition of Inphi Corporation in a USD 10 Bn deal Marvell supplies chips that move data on copper-based cables, but Inphi makes chips that traffic data over fiber-optic cables, something that has proved immensely popular with hyperscale customers. As part of the deal, Inphi’s CEO and president, Dr. Ford Tamer, has now joined the Board of Directors of Marvell.Read More>>Mass Hiring Intel’s USD 20 Bn investment creates thousands of jobs The plan includes 3,000 permanent high-tech, high-wage jobs; over 3,000 construction jobs; and approximately 15,000 local long-term jobs in support companies. Intel’s investment is part of its “IDM 2.0” Initiative – a major evolution of an “integrated device manufacturing” model that aims to make Intel “the only company with the depth and breadth of software, silicon and platforms, packaging, and process with at-scale manufacturing customers can depend on for their next-generation innovations.”Read More>>
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