This week in Semiconductors: Chipmakers fortify manufacturing capabilities as they brace for a connected future.

Latest Reports Published in Draup

Sony Corporation Account Intelligence Report: Sony Corporation’s strengthening its sensing solutions for mobile devices that connect people and automotive sensing solutions to enhance the customer experience. Read More>>
HCL Semiconductor: HCL witnessed a 4.4% Q-o-Q and 2.9% Y-o-Y growth in Dollar revenues in the Q3 of FY2021. Technology and services verticals has experienced growth of 6.8% Q-o-Q and 20.2% Y-o-Y Dollar in Q3 of FY2021. Read More>>

Key Funding Alert

Source – Eta Compute Closes USD 12.5 Mn Series C Funding Led By Synaptics
Company – Eta Compute  
Eta Compute creates energy-efficient AI endpoint solutions that enable sensing devices to make autonomous decisions in energy-constrained environments in smart infrastructure and buildings, consumer, medical, retail, and a diverse range of IoT applications.

Startup Spotlight

Company – VergeSense 
HQ Location – San Francisco Bay Area, US 
Total Funding – USD 22.62 Mn
Verticals – Semiconductor
About: VergeSense is a Y Combinator-backed startup that develops an AI-powered sensing device for facility management.  It uses machine vision to help businesses better understand how their office spaces are being utilized. Read More>>

Key Insights and Signals in Draup

Mergers and Acquisitions
Qualcomm, Google, Microsoft object to Nvidia’s USD 40 Bn purchase of Arm 
The three giants have concerns that the tie-up will limit their access to the British chip design firm’s technology. Qualcomm also reached out to national regulatory organizations in the US, UK, Europe, and China about the issue. Read More>>
FabExchange acquires ON Semiconductor’s Rochester site  
FabExchange is a strategic private equity firm specializing in the acquisition of semiconductor and EMS companies. Industry analysts believe that this acquisition is indeed a win-win for both companies as it is ready and primed for use by wafer fabs for MEMS, CMOS, CCD, and DRAM, and compound semiconductors (i.e., GaN or SiC fab, biochemical) production. Read More>>
Silicon Labs explores breakup, sale of analog chip unit 
Silicon Laboratories Inc is considering a potential breakup and exploring the sale of its analog chip unit. The analog chip business could be worth USD 2 Bn to USD 3 Bn or more, several sources speculated. Read More>>
HFCL joins hands with Qualcomm Technologies for the development of its Wi-Fi 6 Portfolio of Products  
HFCL has strengthened its IO product portfolio of Wireless Solutions with the roll-out of Wi-Fi 6 products in addition to their existing Wi-Fi 5 Access Points (APs). This new range of IO products by HFCL is targeted to serve global Carriers, Enterprises, and Internet Service Providers to provide seamless data connectivity to their consumers. Read More>>
MaxLinear collaborates with Facebook Connectivity
MaxLinear, Inc., a leading provider of radio frequency (RF), analog, digital, and mixed-signal integrated circuits, has announced a collaboration with Facebook Connectivity to integrate silicon technologies and radio processing algorithms into Evenstar radio units (RUs). Read More>>
US Department of Defense partners with GlobalFoundries for 45nm domestic chip partnership 
GF will develop chips at its Fab 8 in Malta, New York, for military applications. Last year, the company made the facility International Traffic in Arms Regulations (ITAR) and Export Administration Regulations (EAR) compliant giving it a greater ability to sell to the military-industrial complex. Read More>>
Marvell and Toshiba extend HDD controller and preamplifier collaboration 
Marvell announced that its hard disk drive (HDD) controller and preamplifier are shipping in Toshiba Electronic Devices and Storage Corporation’s MG09 Series 18TB Cloud-Scale HDD family of products. Read More>>
Visteon partners with ECARX and Qualcomm to develop ‘intelligent cockpits’ for the automotive industry 
Visteon and ECARX, using Qualcomm Snapdragon Automotive Cockpit Platforms, are working together to develop these intelligent technologies and sharing research to commercialize an integrated cockpit project for a variety of vehicle platforms starting in 2021. Read More>>
Intel’s incoming CEO says troubled chip project is recovering, may still outsource some manufacturing 
Pat Gelsinger said that the company’s troubled 7-nanometer chip manufacturing technique is on track to be used to make chips sold in 2023. Read More>>
Executive Movement
CTS Corporation Announces Appointment of Donna M. Costello to its Board of Directors 
Ms. Costello comes to CTS with extensive financial experience and over 25 years of experience in the tech industry, delivering a successful track record of executive leadership, strategy development, and M&A. She currently serves as a director on the board of Neenah, Inc., where she is a member of the audit committee. Read More>>
Micron Appoints Linnie Haynesworth to Its Board of Directors  
Haynesworth has more than 30 years of experience in technology, including aerospace and cybersecurity. Read More>>
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