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This week in Semicon: 5G-led demand for chips highlights concerns on manufacturers inability to overcome chip shortage

Latest Industry Insights from Draup Braindesk

Semiconductor Insights: 

The governments of emerging Asian economies are committed to attracting FDI to strengthen the semiconductor industry and supports introducing new products and services. 

Market Trends: 

Fabrication: Creating wafers that power 5G devices introduces greater complexity into the semiconductor fabrication process as the need for data storage, analysis, and processing power increase.

RFID Circuits: The RFID technology has the potential to penetrate mass markets for low‐cost item tagging, considering the high cost of silicon RFID transponders compared to optical barcodes. 

5G Semiconductor: Chip manufacturers are looking forward to conducting test trials for the broad spectrum of bands. The sub-6 GHz segment led the 5G chipset market in 2019 and is anticipated to dominate the market in the forecast period. 

Device Manufacturing: Growing demand for device manufacturing in sub-10nm equipment, especially for foundry and logic. Demand for these power devices has been growing due to the growth in cloud computing servers and the automotive space 

Case Studies: 

  • ASM International has collaborated with the Japanese Institute of Metals and Materials (JIM). This partnership is to promote a worldwide exchange of information and ideas in the field of materials science. Each group can have the chance to grow its network and resources as a result of the initiative. 
  • Applied Materials acquired Kokusai Electric Corporation, a provider of high-productivity batch wafer processing systems and services for memory, foundry, and logic customers. This acquisition helps Applied Materials to increase its global services business and strengthen customer support capabilities 
  • SK Hynix has started volume production of the industry’s highest-capacity LPDDR5 memory package. The new device features an 18GB capacity and is designed primarily for high-end smartphones as well as laptops that are powered by system-on chips which support LPDDR5. 

Latest Reports Published in Draup

Advanced Micro Devices, Inc. Account Intelligence Report: AMD has expanded its technology capabilities by setting up R&D and innovation centers across the globe, especially in the APAC and Americas regions. Read More>>
Laird Account Intelligence Report: Laird’s business priorities are more aligned towards Thermoelectric coolers, Wireless modules, 5G across its business domains. With this effect, Laird will strengthen its capabilities to meet the future market demands. Read More>>
 

Key Funding Alert

Toronto AI chip startup Untether gets backing from Intel and CPP Investment Board 
Intel Capital co-led a USD 125 Mn investment in Untether AI Corp., a Toronto-based startup that develops high-performance chips for artificial intelligence programs. Canada Pension Plan Investment Board, Canada’s largest pension fund, also participated in the funding round. Read more>>

Startup Spotlight

Company –  Disaster Tech  
Total Funding  USD 1.25 Mn
About: Disaster Tech is a data science tool and custom software delivering a full tech stack built for disaster managers. The company saves lives, protects the environment, and builds resilient communities with the most sophisticated, advanced analytics and distributed high-performance computing platform on the planet. Read more>>

Key Insights and Signals in Semiconductor 

Centre Setup and Expansion 
GlobalFoundries to build New York factory, boost chip output 
The new factory will be at GlobalFoundries’ “Fab 8” site in upstate New York, where its headquarters moved from California earlier this year, it said at an event announcing the plans. The factory will double the site’s chipmaking capacity and add 1,000 jobs, with funding from private-public partnerships, including federal and state investments. Read More>>
Intel is spending USD 20 Bn to build two new chip plants in Arizona 
They will also invest a further USD 7 Bn to double the capacity of its Leixlip plant in Co Kildare, Ireland, including bringing its most advanced d 7 nanometer (nm) chip production to its Leixlip site. The news comes during a global chip shortage that is snarling industries from automobiles to electronics and worries the U.S. is falling behind in semiconductor manufacturing. Read More>>
Deals and Deal Renewal
Ericsson and MediaTek are claiming a new uplink speed record   
The demo aggregated four 100-megahertz component carriers (or channels) of mmWave spectrum in the 39 GHz band combined with one 20-megahertz channel of LTE spectrum in the 1900 MHz band, stitched together for uplink to reach a total peak throughput of 495 Mbps. 5G New Radio (NR) contributed 425 Mbps, while LTE added 70 Mbps. Read More>>
Executive Movement  
Intel elects Andrea Goldsmith to Board of Directors 
Intel Corporation announced that Andrea Goldsmith, dean of engineering and applied science and professor of electrical and computer engineering at Princeton University, was elected to Intel’s board of directors, effective Sept. 1, 2021. Goldsmith will serve as an independent director. Read More>>
Qualcomm appoints new CMO
Qualcomm promoted Don McGuire to the role of CMO with immediate effect, as the chipmaker increases efforts to build brand awareness for its Snapdragon portfolio. McGuire joined Qualcomm from Intel in 2016 and was appointed SVP of global product and technology marketing in late 2020, a role covering business lines spanning mobile, wireless infrastructure, IoT, and automotive. Read More>>
Partnerships
Qualcomm lures partners for wearables push 
The company joined with more than 60 companies to address challenges in the wearables industry, seeking to accelerate the development and commercialization of products and services. The company unveiled the Wearables Ecosystem Accelerator Programme, which aims to foster collaboration between stakeholders. Verizon, Vodafone Group, Arm, and Oppo are among the companies already on board. Read More>>
NXP Semiconductors and MOTER Technologies join forces to extend connected vehicle insurance opportunities  
The partnership links deep vehicle data to the insurance industry for risk assessment and cost modeling and combines NXP’s new S32G2 high-performance automotive processors with MOTER’s insurance data science expertise and software. It also enables vehicle data monetization with new and improved automotive insurance services. Read More>>
AEye partners with Sanmina to scale LiDAR production 
AEye’s uniquely intelligent LiDAR (iDAR™) leverages deterministic AI to focus on what matters most in a vehicle’s surroundings, resulting in greater reliability, safety, and performance at a longer range and lower cost. The transfer from AEye’s pilot line in Dublin, California, to Sanmina’s commercial production lines will take place over the next few months as the company prepares for volume production. Read More>>
Mergers and Acquisition
Dentons advises HORIBA Europe on the acquisition of BeXema   
This deal will enable HORIBA to respond to the need for complex development and test solutions for the growing alternative energy and electric vehicle market.  It will also gain strategically important access to an innovative manufacturer of power electronics, battery inverters, and fuel cells. Read More>>
NVIDIA’s ARM acquisition is facing regulatory hurdles  
The USD 40 Bn ARM acquisition that was announced last September is still in process. The politics involved in this approval could see the deadline extended to September of 2022. Read More>>
New Product Development
Airtel, Intel announces partnership to jointly develop key 5G infrastructure
The two companies collaborate on developing key network infrastructure for next-generation 5G connectivity in India. According to the announcement made earlier today, the companies will collaborate to build 4G and 5G vRAN (virtualized radio access network) and open RAN (open radio access network) infrastructure together. The move will help Airtel build scalable 5G technologies that can be deployed in circles as per requirements. Read More>>
 
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